• 100% RAM CLEARANCE: The asymmetrical heat pipe design ensures RAM compatibility and clearance space
• ONLY 155MM HEIGHT: Low heatsinks for better chassis clearance
• X-VENTS DESIGN: Positioned in a 45-degree angle and surrounding the heatpipe, each fin blade features X-shaped vents that create areas of high and low air pressure, resulting in several controlled vortices. These small and chaotic turbulences produce strong gusts that reduce overall airflow but improve airflow where it matters the most – next to the heatpipes
• DIRECT CONTACT TECHNOLOGY: 4 heatpipes with Direct Contact Technology creates a sleek contact surface area for maximize heat dissipation
• SICKLEFLOW 120 FAN: Newly Optimized blade design with updated curve that provides best balance between airflow and static pressure to take the heat away while remain extremely silence.
• QUIET OPERATION: Low vibrations and quiet fan allows for nearly inaudible levels. More than 10% decreased of fan noise level from previous model.

• EASY INSTALLATION: Tool-free mounting system ensures hassle-free installation. Universal retention brackets are compatible with latest Intel and AMD socket CPU.

HYPER 212 EVO V2 SPEC SHEET